YCS Tin-Planting Arc Pad | Curved Soldering Pad for CPU & NAND IC Reballing

The YCS MINI Infrared Thermal Imaging Camera is designed specifically for precision electronics and mobile repair applications. It allows technicians to observe the thermal condition of a PCB while working under a microscope, making it easier to locate short circuits, abnormal heat sources and faulty components.

Its variable-focus thermal lens provides clearer thermal images by allowing the focus to be adjusted according to the inspection distance. The camera can also be positioned at different angles using its adjustable bracket, providing flexible observation during motherboard diagnostics.

The large-scale clip design features an adjustable clamping range of up to 87mm, allowing the camera to be securely mounted in different working configurations. It can be paired with common trinocular microscopes and supports multiple mounting methods.

Key Features

• YCS MINI Infrared Thermal Imaging Camera
• Variable / adjustable focus thermal lens
• Designed for PCB and motherboard inspection
• Helps identify abnormal heating and fault sources
• Suitable for short-circuit detection
• Real-time thermal imaging
• Image synchronization for easier observation
• Adjustable focal length for clearer thermal images
• Adjustable bracket angle
• Flexible multi-angle observation
• Large-scale clip design
• Up to 87mm adjustable clamping distance
• Compatible with common trinocular microscope setups
• Multiple mounting and connection options
• Compact design for professional repair benches

Applications

🔧 Mobile Motherboard Repair
🔥 Short-Circuit Detection
⚡ PCB Fault Diagnosis
📱 Smartphone Repair
🔬 Microscope-Assisted Inspection
💻 Electronic Component Testing
🛠️ Chip-Level Repair
🌡️ Thermal Fault Detection