YCS 2S CPU Heating Platform | Chip Heating & Glue Removal Station

YCS 2S CPU Heating Platform is designed for professional mobile phone motherboard and chip-level repair applications. It provides a stable and controlled heating surface for CPU heating, IC separation, adhesive softening, glue removal and solder rework.

The platform uses a high-quality aluminum heating plate to provide fast heat transfer and more uniform heating across the working surface. Temperature can be adjusted according to the requirements of different repair jobs, while the built-in temperature sensing system helps maintain consistent heating performance.

A convenient LED temperature indication system provides visual temperature reference during operation. The platform also features a solid metal construction, compact desktop-friendly design and anti-slip support for improved workstation stability.

Key Features

• Model: YCS 2S
• Designed for CPU & IC heating
• Suitable for glue and adhesive removal
• Useful for chip separation and solder rework
• High-quality aluminum heating plate
• Fast heat transfer
• Even heating across the working surface
• Adjustable temperature control
• LED temperature indication
• Built-in temperature sensing
• Heat-resistant insulation structure
• Compact desktop design
• Anti-slip base for stable operation
• Easy-to-clean working surface
• Suitable for extended professional repair sessions