2UUL BH17 CPUREBALL BASE Magnetic Dual-Sided CPU Reballing Platform Set | 75 CPU Stencils for iPhone, Qualcomm, MediaTek, Exynos & HiSilicon

2UUL BH17 CPUREBALL BASE Magnetic Dual-Sided CPU Reballing Platform

The 2UUL BH17 CPUREBALL BASE is an all-in-one professional CPU reballing solution developed for chip-level smartphone repair. Combining a powerful magnetic dual-sided platform with 75 precision laser-cut stainless steel stencils, it provides technicians with everything needed for accurate CPU, eMMC, and RAM reballing.

The platform features two working thicknesses:

• T0.60 – Optimized for Apple CPUs
• T0.35 – Designed for Android CPU reballing

Its strong magnetic locking system securely holds stencils in place, preventing movement during solder paste application and hot air rework. This ensures consistent solder ball alignment, reduces repair errors, and increases work efficiency.

The included 75 CPU stencil set supports the latest smartphone chipsets, making the BH17 one of the most complete CPU reballing platforms available for professional repair shops.

Compatible CPU Platforms

Apple (12 Models)

• A10
• A11
• A12
• A13
• A14
• A15
• A16
• A17
• A18
• A18 Pro
• A19
• A19 Pro

Qualcomm Snapdragon (17 Models)

Supports major Snapdragon processors including:

• SM8450
• SM8475
• SM8550
• SM8650
• SM8750
• SM7325
• SM7125
• SM7150
• SM7450
• SM7550
• SM7750
• SM8250 series
• And more

MediaTek (14 Models)

Compatible with popular MediaTek Dimensity and Helio processors including:

• MT6895
• MT6989
• MT6983
• MT6877
• MT6875
• MT6855
• MT6833
• MT6781
• MT6761
• And more

Samsung Exynos (11 Models)

Supports:

• Exynos 2200
• Exynos 2100
• Exynos 990
• Exynos 9820
• Exynos 9815
• Exynos 1480
• Exynos 1380
• Exynos 1330
• And additional Exynos processors

HiSilicon (9 Models)

Compatible with:

• Kirin 9000
• Kirin 990
• Kirin 980
• Kirin 970
• Kirin 920
• Kirin 810
• And more

eMMC & RAM (12 Models)

Supports multiple:

• eMMC
• RAM
• BGA memory package sizes

Key Features

• Model: BH17
• Dual-sided magnetic CPU reballing platform
• Two working thicknesses: T0.35 & T0.60
• Includes 75 precision stainless steel stencils
• Powerful magnetic fixing system
• Quick stencil alignment
• High-precision laser-cut openings
• Compatible with Apple, Qualcomm, MediaTek, Samsung Exynos, HiSilicon, eMMC & RAM
• Durable CNC-machined construction
• Designed for professional BGA chip repair
• Ideal for CPU reballing, chip replacement, and microsoldering

Applications

• CPU reballing
• Smartphone motherboard repair
• Apple logic board repair
• Android motherboard repair
• BGA chip replacement
• eMMC repair
• RAM reballing
• IC replacement
• Microsoldering
• Mobile phone repair workshop

Product Highlights

• Model BH17
• 75 Precision CPU Stencils
• Magnetic Dual-Sided Platform
• Dual Thickness Design (T0.35 & T0.60)
• Powerful Magnetic Lock
• Fast Stencil Positioning
• Supports Apple & Android CPUs
• Professional Chip-Level Repair Tool

The 2UUL BH17 CPUREBALL BASE is a professional magnetic dual-sided CPU reballing platform designed for advanced BGA chip repair. Featuring 75 precision stainless steel stencils, dual-thickness support (T0.35 & T0.6), and compatibility with Apple, Qualcomm, MediaTek, Exynos, HiSilicon, eMMC, and RAM chips, it delivers fast, accurate, and reliable CPU reballing for professional repair technicians.

The 2UUL BH17 CPUREBALL BASE is a professional magnetic dual-sided CPU reballing platform designed for advanced BGA chip repair. Featuring 75 precision stainless steel stencils, dual-thickness support (T0.35 & T0.6), and compatibility with Apple, Qualcomm, MediaTek, Exynos, HiSilicon, eMMC, and RAM chips, it delivers fast, accurate, and reliable CPU reballing for professional repair technicians.