2UUL DA28 FlatCut Solder Pad Underfill Glue Fast Removal Blades (5 PCS) | CPU Underfill Removal Tool

The 2UUL DA28 FlatCut Solder Pad Underfill Glue Fast Removal Blades are engineered for technicians who require fast, precise, and reliable underfill glue removal during mobile phone motherboard repair.

Manufactured with a razor-sharp angled edge, these blades effortlessly cut through underfill adhesive around CPU chips while minimizing the risk of damaging solder pads or PCB traces. The optimized blade geometry offers excellent control, allowing technicians to remove hardened glue quickly and efficiently.

Each pack contains 5 precision blades stored in a compact protective case, making them convenient for daily repair work. A polishing sandpaper is also included to help maintain blade performance and extend service life.

Key Features

• Precision FlatCut blade for underfill glue removal
• Sharp angled edge for fast and clean cutting
• Ideal for CPU chip and motherboard repairs
• Removes solder pad underfill adhesive safely
• High-quality stainless steel construction
• Excellent control for precision repair work
• Includes 5 blades per storage box
• Compact protective storage case included
• Bonus polishing sandpaper for blade maintenance
• Suitable for professional mobile phone repair technicians

The 2UUL DA28 FlatCut Fast Removal Blades are precision replacement blades designed for fast and safe removal of solder pad underfill glue from CPU chips and mobile phone motherboards. Featuring a sharp angled cutting edge, these professional-grade blades provide clean, accurate, and damage-free underfill removal for advanced motherboard repair.

The 2UUL DA28 FlatCut Fast Removal Blades are precision replacement blades designed for fast and safe removal of solder pad underfill glue from CPU chips and mobile phone motherboards. Featuring a sharp angled cutting edge, these professional-grade blades provide clean, accurate, and damage-free underfill removal for advanced motherboard repair.