2UUL BG01 ABCD Reballing Stencil for iPh 8-16PM (4pcs/pack)

2UUL BG01 ABCD Reballing Stencil (4PCS/Pack)

The 2UUL BG01 ABCD Reballing Stencil Kit is a premium 4-piece BGA reballing stencil set engineered for professional mobile repair technicians. Designed for iPhone 8 through iPhone 16 Pro Max, this all-in-one solution combines multiple chip layouts into just four precision stencils, improving efficiency while reducing clutter in your repair workspace.

Manufactured from high-quality stainless steel with precision laser-cut openings, the BG01 stencil kit ensures accurate solder ball alignment for consistent and professional-quality chip reballing.

Stencil Layout

Stencil A

• CPU
• NAND Flash
• Main Processor

Stencil B

• Baseband IC
• WiFi IC
• Communication IC

Stencil C

• RF IC
• Power Amplifier
• Small IC Components

Stencil D

• Display IC
• Face ID Module
• Charging Port IC
• Proximity Sensor
• True Tone IC
• Camera Module
• Other motherboard ICs

Unlike traditional stencil collections requiring dozens of separate templates, the BG01 ABCD system organizes all major iPhone chip layouts into only four durable stencils, saving time during repairs while improving workflow.

Each package also includes 4 complimentary precision blades for easy handling and positioning during reballing.

Features

• Model: BG01
• Compatible with iPhone 8 to iPhone 16 Pro Max
• 4 precision stainless steel reballing stencils
• Covers CPU, NAND Flash, Baseband, WiFi, RF, Face ID, Camera, Charging IC, and more
• Precision laser-cut BGA patterns
• High durability stainless steel construction
• Fast and accurate chip alignment
• Streamlined 4-stencil design
• Includes 4 free precision blades
• Ideal for professional motherboard and microsoldering repairs

The 2UUL BG01 ABCD Reballing Stencil Kit is a professional 4-piece stainless steel BGA stencil set designed for iPhone 8 to iPhone 16 Pro Max motherboard repairs. The kit includes four precision stencils covering CPU, NAND Flash, Baseband IC, WiFi IC, RF IC, Face ID, Camera Module, Charging IC, and other essential chips, providing fast, accurate, and reliable chip reballing for professional technicians.

The 2UUL BG01 ABCD Reballing Stencil Kit is a professional 4-piece stainless steel BGA stencil set designed for iPhone 8 to iPhone 16 Pro Max motherboard repairs. The kit includes four precision stencils covering CPU, NAND Flash, Baseband IC, WiFi IC, RF IC, Face ID, Camera Module, Charging IC, and other essential chips, providing fast, accurate, and reliable chip reballing for professional technicians.