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LUOWEI Practica SP3 Solder Paste series
The LUOWEI Practica SP3 Solder Paste series provides an advanced chip-level soldering solution engineered explicitly for mobile phones, computer repair, and high-precision PCB assemblies.
Key Features & Technical Specifications:
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Viscosity & Consistency: Formulated with an upgraded oxidation-resistant composition that ensures optimal paste uniformity, stable storage, and smooth application without dry-out.
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Safety Profile: Lead-free and halogen-free formula with “no sour taste,” creating a safer, more eco-friendly workspace for repair technicians.
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High Performance: Guarantees fast, accurate soldering, robust solder wicking, rounded joints, and absolutely no cold joints or solder bridging.
Application & Selection Guide:
| Specification | Compatibility & Use Case | Target Repair Parts |
| 138 | Apple iPhone Models X to 11 Pro Max (Low-temperature boards) | Middle Layer Lamination |
| 158 | Universal compatibility for standard mobile phone BGA chipsets | Middle Layer Lamination |
| 183 | Universal mobile repair hardware | CPU, Chip, IC, Hard Disk, Tail Plug |
| 199 | Universal heavy-duty mobile/tablet/computer repair | CPU, Chip, IC, Hard Disk, Tail Plug |
| 217 | Apple iPhone 12 series and above / High-end domestic models | CPU, Chipset, Hard Drive, IC, etc. |
Price range: ₹240.00 through ₹359.00